ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,219, issued on March 18, was assigned to Hotwire Development LLC (Scottsdale, Ariz.). "Anchor system" was invented by Jeffrey S. Doss (Sco... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,004, issued on March 18, was assigned to NCHAIN LICENSING AG (Zug, Switzerland). "Maintaining blocks of a blockchain in a partitioned bloc... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,602, issued on March 18, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA MOTORS Corp. (Seoul, South Korea). "Method and... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,251, issued on March 18, was assigned to Telefonaktiebolaget LM Ericsson (Publ) (Stockholm). "Exchange of parameters relating to measureme... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. D1,067,474, issued on March 18, was assigned to Shenzhen Huiruimei Green Technology Co. Ltd. (Shenzhen, China). "Candle set" was invented by Zong... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,038, issued on March 18, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan) and SUBARU Corp. (Tokyo). "Vehicle and vehicle control method... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,804, issued on March 18, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Method of forming photoresist pattern and proj... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,957, issued on March 18, was assigned to ZF CV Systems Global GmbH (Bern, Switzerland). "Method for setting up a data connection, and data... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,652, issued on March 18, was assigned to ExxonMobil Chemical Patents Inc. (Baytown, Texas). "Methylparaffins obtained through isomerizatio... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,079, issued on March 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method ... Read More